0.35um 3.3V/5V Process
0.35um 3.3V/5V embedded Logic NVM Process
This process is a Dual GOX process with 3.3V and 5V devices for logic products, and high resistance Poly2, PIP capacitors and Bipolar for analog designs. This process combines YMC 3.3V MTP NVM IP to minimize mask costs. YMC NVM IP consists of three forms of memory type- (1) EEPROM (2) Flash (3) MTP, and provides IP for memory density from 256x8 bits to 16Kx16 bits. This process has been widely used in Microcontroller(MCU) products. For convenience of digital circuit design, a 3.3V and 5V Standard Cell Library and 3.3V SRAM compiler service are also provided.
Design Kits
| Design Kits | Vender | Tools / Version | |
|---|---|---|---|
| SPICE | - | HSIPCE | BSIM3V3 (L49) |
| Spectre SPICE | |||
| DRC | Mentor Graphics | Calibre | |
| LVS | Mentor Graphics | Calibre | |
| LPE | Mentor Graphics | Calibre | |
| Cell Library | - |
0.35um 3.3V Standard Cell / IO Cell Library |
|
| NVM IP |
YMC (MTP, Flash, EEPROM) |
Density 256 X 8 bits ~ 16K X 16 bits Byte Write / Byte Read Extra Low Read Voltage ~1.2V Endurance >100K |
|
| SRAM | - |
0.35um 3.3V SRAM compiler (64 x 2bits ~ 4K x 8 bits) |
|
| Mismatch Report | - | 0.35um 3.3V mismatch report | |