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Watch time - 4:32
In this video, we introduce the overview and key features of the semiconductor laser products for advanced semiconductor packaging, “KLC330FL01WW” and “KLC434FL01WW”, which were announced in press releases on January 16, 2026 and April 15, 2026, respectively.
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(This video contains AI-generated content.)
【KLC330FL01WW】
Press Release: https://nuvoton.co.jp/semi-spt/apl/rd/?id=1100-0210
Product Details: https://nuvoton.co.jp/semi-spt/apl/rd/?id=1100-0211
【KLC434FL01WW】
Press Release: https://nuvoton.co.jp/semi-spt/apl/rd/?id=1100-0311
Product Details: https://nuvoton.co.jp/semi-spt/apl/rd/?id=1100-0312
00:00 Trends in Advanced Semiconductor Packaging
01:13 Features of Maskless Lithography and Requirements for Semiconductor Lasers
02:01 Overview of the New Product: Semiconductor Laser for Advanced Packaging
02:33 Feature1: Device structure to enhance wall-plug efficiency
03:08 Feature2: High thermal conduction package technology that efficiently dissipates heat
04:03 Expanded Lineup of "Mercury Lamp Replacement Solutions"
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