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M2351SFSIAAP

The M2351SFSIAAP microcontroller series is powered by Arm® Cortex®-M23 core with TrustZone® for Armv8-M architecture, having multi-chip-package (MCP) with M2351 Series and Winbond’s W77F Secure Flash. With the use of Winbond’s Secure Flash solution, M2351SFSIAAP can well protect code and data of a microcontroller from reducing vulnerability exposures.

In addition to the enhanced security of microcontroller storage, the M2351SFSIAAP remains to keep all the security features with the M2351 Series, covering Arm®v8-M TrustZone®, Execute Only Memory (XOM), Cryptographic Hardware Accelerators, Secure Debug, system-level tamper detection pins, and all software tools for application development are same with M2351 Series. The package dimension is also the same with M2351 Series in LQFP-64.

Key Features:

• Security Core
  - Arm® Cortex®-M23 core delivering 0.95 DMIPS per MHz
  - TrustZone® for ARM®v8-M
  - 32-bit Single-cycle hardware multiplier and 32-bit 17-cycle hardware divider
  - Up to 8 regions MPU_NS (for non-secure world)
  - Up to 8 regions MPU_S (for secure world)
  - 8 Security Attribution Unit (SAU) memory regions
     
• Memories
  - Up to 512 KB of dual bank flash memory. Dual bank Flash memory allows read-while-write programming
  - Up to 96 KB SRAM, first 32KB SRAM with hardware parity check
  - 4 KB Flash for user program loader (LDROM)
  - 2 KB OTP for general-purpose control use, (2 KB data + 1 KB lock bit) easy for PLM (Product Lifecycle Management) implementation
  - 32 KB Secure Boot ROM
  - ISP/ICP/IAP programming
  - External Bus Interface (EBI) supports maximum external address space of 1 M Bytes, up to 3 chip selects and 8/16-bit external data bus
     
• Secure Flash stacked
  - 4 MByte Flash memory density
  - Secure Binding and communication between MCU and Secure Flash
     
• Power management
  - Normal run: 97 μA/MHz (LDO);
  -                    45 μA/MHz (DC-DC)
  - Idle: 36 μA/MHz (CPU clock disabled, LDO);
  -         17μA/MHz (CPU clock disabled, DC-DC)
  - Power-down: 20 μA
  - Standby power-down: 3.0 μA
  - Deep Power-down: 4.0 μA (with VBAT)
  - Deep Power-down: 1.5 μA (without VBAT)
  - VBAT supply for RTC:  2.5 μA (80 bytes spare registers)
     
• Crypto and Security
  - True random number generator (TRNG)
  - AES 256/ SHA 384/ 3-DES/ DES
  - The ECC accelerator is a fully compliant implementation for the prime field GF(p) and binary field GF(2m) algorithms. The prime field GF(p) supports up to NIST P-521. The binary field GF(2m) supports up to NIST B-571 and NIST K-163, K-233, K-283, K-409, and K-571.
  - CRC calculation unit
     
• Communication interfaces
  - Up to 11 UART interfaces (up to 10.66 MHz), with up to 3 ISO-7816-3 interfaces, 6 RS-485, 6 IrDA and 2 LIN interfaces
  - Up to 5 I²C interfaces (up to 1 Mbps), with up to 3 I²C with SM Bus/ PM Bus
  - Up to 7 SPI interfaces (up to 64 MHz), with 4 I²S interfaces, additional 1 Quad-SPI interface
  - Up to 5 I²S interfaces, 4 I²S shared with 4 SPI
  - Secure Digital I/O (SDIO)(up to 50 MHz)
     
• Advanced connectivity
  - USB 2.0 full speed OTG controller with on-chip PHY
  - One CAN interface up to 1 Mbps (CAN 2.0A and 2.0B standard)
  - Support crystal-less USB
     
• Operating Characteristics
  - Running up to 64 MHz
  - Voltage range: 1.7V to 3.6 V
  - Temperature range: -40°C to 105°C
  - Selectable core power voltage levels: 1.26V, 1.2V in run and idle mode
     
• Packages (RoHS)
  - LQFP 64-pin

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