The Nuvoton Technology Corporation Board of Directors has approved Robert Hsu to take the role of Vice Chairman and Dr. Shang-E Tai to take the role and title of President.

The Nuvoton Technology Corporation Board of Directors has approved the following important nominations. Effective 2014-01-23, President Robert Hsu will concurrently take the role of Vice Chairman to assist Chairman. Starting 2014-02-05, Vice Chairman Robert Hsu will transfer to act in the position as Chief Technology Officer (CTO). At the same time, Nuvoton would invite Dr. Shang-E Tai to take the role and title of President.

Nuvoton claims that Dr. Robert Hsu served as the President of Winbond Electronics Corporation between 2005 and 2008. He led the Logic IC business spin-off of Winbond Electronics Corporation to establish Nuvoton Technology Corporation, which was then listed on the Taiwan Stock Exchange (TSE) in 2010. Dr. Robert Hsu built a management system, fostered talent and focused on key products to lay a solid foundation. Dr. Robert Hsu successful led Nuvoton to become the world's largest leading suppliers of ARM ® Cortex ™ - M0 32-bit general-purpose microcontrollers in his three years with the company. He set an important milestone for the development and undertaking domain. The promotion of Dr. Hsu comes as Vice Chairman, he will lead our employees to continue innovation, and be responsible for long-term technology development.

President Tai has a PhD from the Dept. of Electrical Engineering at Yale University, U.S.A. He has served in positions at Realtek Semiconductor Corporation, Silicon Touch Technology Inc., Winbond Electronics Corporation, Taiwan Semiconductor Manufacturing Company and AT&T Bell Laboratories. He possesses a wealth of experience in the fields of R&D, Marketing, Sales and Management. Nuvoton believes under President Tai’s leadership, Nuvoton will continue to grow.

About Nuvoton

Nuvoton Technology Corporation (NTC) was founded to bring innovative semiconductor solutions to the market. NTC was spun-off as a Winbond Electronics affiliate in July 2008 and became public in September 2010 on the Taiwan Stock Exchange (TSE). Nuvoton Technology focuses on development of analog/mixed signal, microcontroller, cloud and computing products and has strong market share in Industrial, Consumer and Computer markets. Nuvoton owns a wafer fab, featuring customized processes for analog, power and MCU products. Besides in-house IC products, the wafer fab also provides part of its capacity for foundry services. Nuvoton Technology provides products with a high performance/cost ratio for its customers by leveraging flexible technology, advanced design capability and integration of digital and analog technologies. Nuvoton values long term relationships with its partners and customers and is dedicated to continuous innovation of its products, processes and services. The company has established subsidiaries in the USA, China and Israel to strengthen regional customer support and global management. For more information, please visit

Hsiang-Yun Fan
Tel: +886-3-5770066 ext. 3118

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