Corporate Officers
Chairman
Arthur Yu-Cheng ChiaoEducation
MS in Electrical Engineering, University of Washington
BS in Telecommunication Engineering, National Chiao Tung University
Major Experience
Chairman, Walsin Lihwa Corp.
President
Robert Hsu Education
Ph.D. in Electrical Engineering, University of Southern California
MS in Electrical Engineering, National Taiwan University
BS in Electrical Engineering, National Taiwan University
Major Experience
Deputy CEO, Winbond Electronics Corp.
President, Winbond Electronics Corp.
Vice President of Logic IC Business Group, Winbond Electronics Corp.
Vice President of Sales Center, Winbond Electronics Corp.
Assistant Vice President of Sales Center, Winbond Electronics Corp.
Group Leader, Communication Systems Research Sec., Jet Propulsion Lab., California Institute of Technology
Associate Director, VLSI Laboratory, Communication Science Institute, University of Southern California, L.A.
23 years experiences in R&D and sales of the semiconductor products
Consumer Electronics Business Group Head
Stephen Rei-Min Huang
Education
MBA in International Management, Thunderbird School Major Experience
Business Executive of Consumer IC Business Group, Winbond Electronics Corp.
Vice President of Product Center, Winbond Electronics Corp.
23 years experiences in R&D and marketing of the semiconductor products
Computer Business Group Head
Bor-Yuan HwangEducation
Ph.D. in Electrical & Computer Engineering, University of Florida
Major Experience
Assistant Vice President of Personal Computer Product Center, Winbond Electronics Corp.
President, Biomorphic Microsystems Corporation
President, CmoX Technology Corporation Ltd.
Vice President, IC Media Corporation, CA
Senior Department Manager, Motorola, Arizona.
23 years experiences in R&D and marketing of the semiconductor products
Manufacturing Business Group Head
Yu-Fu Chang
Education
BS in Electronic Engineering, National Cheng Kung University
Major Experience
Assistant Vice President of 200mm Memory Manufacturing Center, Winbond Electronics Corp.
Director of Logic Products Wafer FAB II, Winbond Electronics Corp.
22 years experiences in manufacturing of the semiconductor products
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